• Full Turnkey from Schematic to Assembled Board
• Digital Signal Processing, CompactPCI form factor
• 12 Layers - 6 Signal, 6 Planes, Via In Pad
• Controlled Length and Differential Routing
• Mixed Impedances: 50 Ohms, 65 Ohms, 100 Ohm Differential
• Xilinx BGA's, 456-pin and 608-pin
• 10 Different Power Supplies
• DAC circuitry with Matched-Length routing

Gallery Sample 1
Top Side View