Gallery Sample 1
Bottom Side View
Bottom Side View
Board Information:
- Full Turnkey from Schematic to Assembled Board
- Digital Signal Processing, CompactPCI form factor
- 12 Layers - 6 Signal, 6 Planes, Via In Pad
- Controlled Length and Differential Routing
- Mixed Impedances: 50 Ohms, 65 Ohms, 100 Ohm Differential
- Xilinx BGA's, 456-pin and 608-pin
- 10 Different Power Supplies
- DAC circuitry with Matched-Length routing
Via-In-Pad
Great BGA Test Points
Caps Fit Under BGA
Thermal Pad
Thermal Pad